The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 15, 2019

Filed:

May. 31, 2016
Applicant:

Avago Technologies General Ip (Singapore) Pte. Ltd., Singapore, SG;

Inventors:

David Thomas Martin, Fort Collins, CO (US);

Keri Liane Williams, Fort Collins, CO (US);

Sean Hansen, Sunnyvale, CA (US);

Lori Ann Callaghan, Menlo Park, CA (US);

Lovell Harold Camnitz, Santa Clara, CA (US);

Alexia Polland Kekoa, Fremont, CA (US);

Kun Wang, Sunnyvale, CA (US);

Bernhard Ulrich Koelle, Milpitas, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 9/17 (2006.01); H01L 41/22 (2013.01); H01L 41/09 (2006.01); H03H 9/02 (2006.01); H03H 3/02 (2006.01);
U.S. Cl.
CPC ...
H03H 9/17 (2013.01); H03H 3/02 (2013.01); H03H 9/02157 (2013.01);
Abstract

In a bulk acoustic resonator device, at least one additional metal feature is formed on a top surface of the bottom electrode at a location at which the bottom electrode electrical contact will subsequently be formed, thereby thickening the metal at the location below where the piezoelectric material layer will be etched to form the opening for the bottom electrode electrical contact. Consequently, even though some of the metal of the additional metal feature and/or of the bottom electrode will be removed during the process of etching the opening in the piezoelectric material layer, the bottom electrode will always retain sufficient thickness after the piezoelectric material layer is etched.


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