The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 15, 2019
Filed:
Sep. 29, 2016
Tyco Electronics Corporation, Berwyn, PA (US);
Jason Anthony Osborne, Stoneville, NC (US);
Fernando Luis Sierra, Winston-Salem, NC (US);
Jason Thomas Chiota, Harrisburg, PA (US);
TE CONNECTIVITY CORPORATION, Berwyn, PA (US);
Abstract
Molding assemblies and molding processes are disclosed. The molding assemblies are for producing a product and include a first subassembly and a second subassembly for the producing of the product. The first subassembly includes a cavity insert arrangement corresponding with the design of the product, a movable insert abutting the cavity insert arrangement, and rail members securing the movable insert with interlocking features at a specific location, the specific location being one of multiple movable insert positions. The molding process includes molding a first product with the movable insert and the additional movable insert being positioned at a first movable insert portion, removing the subassembly from the second subassembly, re-positioning the movable insert and the additional movable insert to a second movable insert position, and molding a second product with the movable insert and the additional movable insert being positioned at the second movable insert portion.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile