The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 08, 2019

Filed:

May. 28, 2015
Applicant:

Honeywell International Inc., Morristown, NJ (US);

Inventors:

James L. Tucker, Clearwater, FL (US);

Romney R. Katti, Shorewood, MN (US);

Assignee:

Honeywell International Inc., Morris Plains, NJ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01); H05K 7/02 (2006.01); H05K 5/06 (2006.01); H05K 13/00 (2006.01); H01L 25/065 (2006.01); H01L 25/00 (2006.01); H01L 23/40 (2006.01); H01L 25/10 (2006.01); H01L 23/367 (2006.01); H01L 23/373 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H05K 7/026 (2013.01); H01L 21/4882 (2013.01); H01L 23/367 (2013.01); H01L 23/3731 (2013.01); H01L 23/3736 (2013.01); H01L 23/40 (2013.01); H01L 23/4006 (2013.01); H01L 25/0652 (2013.01); H01L 25/0657 (2013.01); H01L 25/105 (2013.01); H01L 25/50 (2013.01); H05K 5/069 (2013.01); H05K 13/00 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/06135 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/291 (2013.01); H01L 2224/32227 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48145 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/49109 (2013.01); H01L 2224/73207 (2013.01); H01L 2224/73215 (2013.01); H01L 2224/73257 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/8148 (2013.01); H01L 2224/81424 (2013.01); H01L 2224/81439 (2013.01); H01L 2224/81444 (2013.01); H01L 2224/81447 (2013.01); H01L 2224/81484 (2013.01); H01L 2224/8348 (2013.01); H01L 2224/83424 (2013.01); H01L 2224/83439 (2013.01); H01L 2224/83444 (2013.01); H01L 2224/83447 (2013.01); H01L 2224/83484 (2013.01); H01L 2224/8548 (2013.01); H01L 2224/85424 (2013.01); H01L 2224/85439 (2013.01); H01L 2224/85444 (2013.01); H01L 2224/85447 (2013.01); H01L 2224/85484 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06506 (2013.01); H01L 2225/06537 (2013.01); H01L 2225/06562 (2013.01); H01L 2225/06575 (2013.01); H01L 2225/06589 (2013.01); H01L 2225/06593 (2013.01); H01L 2225/107 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1094 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/14 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/1435 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/3025 (2013.01);
Abstract

A circuit package for electrically connecting a plurality of modules. The circuit package having a first and second mounting plate, each including a plurality of module connectors configured to receive and form electrical connections with the plurality of modules. The circuit package also having a first and second sidewall mounted to the first and second mounting plates. The first sidewall including a plurality of sidewall fins extending outward from the first sidewall so that the plurality of sidewall fins are positioned between the first and second mounting plates and at least partially interleave with the plurality of modules.


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