The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 08, 2019
Filed:
Jul. 13, 2017
Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;
Chia-Yu Wei, Tainan, TW;
Chin-Hsun Hsiao, Kaohsiung, TW;
Yi-Hsing Chu, Tainan, TW;
Yen-Liang Lin, Tainan, TW;
Yung-Lung Hsu, Tainan, TW;
Hsin-Chi Chen, Tainan, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu, TW;
Abstract
A method of manufacturing a semiconductor structure includes receiving a substrate and an interlayer dielectric (ILD) over the substrate; bonding the substrate and the ILD over a carrier substrate; forming a recessed portion extended through the substrate and the ILD; disposing a conductive material into the recessed portion; and removing the carrier substrate, wherein the conductive material is in contact with the ILD and is separated from the substrate.