The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 08, 2019
Filed:
Feb. 06, 2017
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Jeffrey P. Gambino, Portland, OR (US);
Thomas J. Hartswick, Underhill, VT (US);
Zhong-Xiang He, Essex Junction, VT (US);
Anthony K. Stamper, Williston, VT (US);
Eric J. White, Charlotte, VT (US);
Assignee:
INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/78 (2006.01); H01L 21/288 (2006.01); H01L 21/768 (2006.01); H01L 23/522 (2006.01); H01L 23/00 (2006.01); H01L 23/485 (2006.01); H01L 23/532 (2006.01); H01L 21/3205 (2006.01); H01L 21/285 (2006.01); H01L 23/58 (2006.01); H01L 23/528 (2006.01); C25D 7/12 (2006.01); C25D 3/38 (2006.01); C25D 5/10 (2006.01);
U.S. Cl.
CPC ...
H01L 21/2885 (2013.01); C25D 3/38 (2013.01); C25D 5/10 (2013.01); C25D 7/123 (2013.01); H01L 21/288 (2013.01); H01L 21/2855 (2013.01); H01L 21/28518 (2013.01); H01L 21/28556 (2013.01); H01L 21/28568 (2013.01); H01L 21/32053 (2013.01); H01L 21/7685 (2013.01); H01L 21/76802 (2013.01); H01L 21/76843 (2013.01); H01L 21/76846 (2013.01); H01L 21/76873 (2013.01); H01L 21/76877 (2013.01); H01L 21/76879 (2013.01); H01L 21/76883 (2013.01); H01L 21/76885 (2013.01); H01L 21/76886 (2013.01); H01L 21/76898 (2013.01); H01L 21/78 (2013.01); H01L 23/485 (2013.01); H01L 23/522 (2013.01); H01L 23/528 (2013.01); H01L 23/5226 (2013.01); H01L 23/53209 (2013.01); H01L 23/53238 (2013.01); H01L 23/585 (2013.01); H01L 24/95 (2013.01); H01L 2225/06541 (2013.01); H01L 2924/0002 (2013.01);
Abstract
A semiconductor structure with low resistance conduction paths and methods of manufacture are disclosed. The method includes forming at least one low resistance conduction path on a wafer, and forming an electroplated seed layer in direct contact with the low resistance conduction path.