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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10176973 B1

PDFFull Text
Date of Patent:
Jan. 08, 2019

Filed:

Jan. 20, 2017

Method of cooling a composition using a hall effect enhanced capacitively coupled plasma source, an abatement system, and vacuum processing system

Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Michael S. Cox, Gilroy, CA (US);

Rongping Wang, Cupertino, CA (US);

Brian T. West, San Jose, CA (US);

Roger M. Johnson, Livermore, CA (US);

Colin John Dickinson, San Jose, CA (US);

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorney:

Patterson + Sheridan LLP

Primary Examiner:

Tracie Y Green

Int. Cl.
CPC ...
B01D 53/64 (2006.01); B01D 53/68 (2006.01); H01J 37/32 (2006.01); B01D 53/32 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32844 (2013.01); B01D 53/323 (2013.01); H01J 37/32082 (2013.01); H01J 37/32357 (2013.01); H01J 37/32495 (2013.01); H01J 37/32541 (2013.01); H01J 37/32568 (2013.01); H01J 37/32596 (2013.01); H01J 37/32669 (2013.01); H01J 37/32825 (2013.01); H01L 21/02123 (2013.01); H01L 21/02274 (2013.01); B01D 2257/55 (2013.01); B01D 2257/553 (2013.01); B01D 2257/556 (2013.01); B01D 2258/0216 (2013.01); H01J 2237/332 (2013.01); H01J 2237/334 (2013.01); H01J 2237/335 (2013.01); Y02C 20/30 (2013.01);
Abstract

Embodiments disclosed herein include a method for abating compounds produced in semiconductor processes. The method includes energizing an abating agent, forming a composition by reacting the energized abating agent with gases exiting a vacuum processing chamber, and flowing the composition through a plurality of holes formed in a cooling plate. By cooling the composition with the cooling plate, damages on the downstream pump are avoided.

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