The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 08, 2019

Filed:

Apr. 16, 2013
Applicants:

Dupont Teijin Advanced Papers (Japan), Ltd., Chiyoda-ku, Tokyo, JP;

Kawamura Sangyo Co., Ltd., Yokkaichi, Mie, JP;

Inventors:

Tatsushi Fujimori, Tokyo, JP;

Shinji Naruse, Tokyo, JP;

Chihiro Kondo, Tokyo, JP;

Yoshihiko Kagetani, Mie, JP;

Hisashi Katsumata, Mie, JP;

Masashi Kato, Mie, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 27/34 (2006.01); B32B 27/16 (2006.01); D21H 13/26 (2006.01); H01B 3/30 (2006.01); H01B 7/29 (2006.01); H01B 7/295 (2006.01); B32B 27/12 (2006.01); B32B 27/28 (2006.01); B32B 27/36 (2006.01); B32B 27/08 (2006.01); B32B 37/10 (2006.01); B32B 37/18 (2006.01); D21H 27/30 (2006.01); B32B 37/06 (2006.01); B32B 38/00 (2006.01); B32B 37/00 (2006.01);
U.S. Cl.
CPC ...
B32B 27/34 (2013.01); B32B 27/08 (2013.01); B32B 27/12 (2013.01); B32B 27/16 (2013.01); B32B 27/286 (2013.01); B32B 27/36 (2013.01); B32B 37/10 (2013.01); B32B 37/182 (2013.01); D21H 13/26 (2013.01); H01B 3/305 (2013.01); H01B 7/292 (2013.01); H01B 7/295 (2013.01); B32B 37/06 (2013.01); B32B 38/0008 (2013.01); B32B 2037/0092 (2013.01); B32B 2250/02 (2013.01); B32B 2250/24 (2013.01); B32B 2262/0269 (2013.01); B32B 2307/206 (2013.01); B32B 2310/14 (2013.01); B32B 2379/08 (2013.01); B32B 2457/04 (2013.01); D21H 27/30 (2013.01); Y10T 428/24942 (2015.01); Y10T 428/31544 (2015.04); Y10T 428/31721 (2015.04); Y10T 428/31725 (2015.04); Y10T 428/31736 (2015.04);
Abstract

Provided is an a aramid-resin film laminate comprising an aramid paper comprising an aramid fibrid and an aramid short fiber, and a resin film laminated on each other. The aramid-resin film laminate is obtained by conducting a plasma treatment on a surface of the aramid paper, the surface having a skin layer portion whose heat of fusion measured with a differential scanning calorimeter (DSC) is 25 cal/g or less, and bonding the aramid paper and the resin film to each other by heating, pressing, or heating under pressure, with the plasma treated surface of the aramid paper and a plasma treated surface of the resin film facing each other. This laminate is an aramid-resin film laminate in which the aramid paper and the resin film are laminated on each other without using any adhesive agent and without impairing characteristics of both the aramid paper and the resin film, and is excellent in heat resistance, electrical characteristics, chemical resistance, mechanical characteristics, and the like.


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