The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 01, 2019

Filed:

Sep. 06, 2017
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Chun-Tsung Kuo, Tainan, TW;

Chuan-Feng Chen, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/70 (2006.01); H01L 29/732 (2006.01); H01L 29/06 (2006.01); H01L 29/08 (2006.01); H01L 29/66 (2006.01); H01L 29/16 (2006.01); H01L 29/10 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7325 (2013.01); H01L 29/06 (2013.01); H01L 29/0649 (2013.01); H01L 29/08 (2013.01); H01L 29/0804 (2013.01); H01L 29/0821 (2013.01); H01L 29/10 (2013.01); H01L 29/1004 (2013.01); H01L 29/16 (2013.01); H01L 29/66 (2013.01); H01L 29/66234 (2013.01); H01L 29/732 (2013.01);
Abstract

A semiconductor device structure is provided. The semiconductor device structure includes a collector element formed in or over a semiconductor substrate. The semiconductor device structure also includes a semiconductor element over the collector element, and the semiconductor element has a top surface, a bottom surface, and a side surface. The semiconductor device structure further includes an emitter element over the top surface of the semiconductor element. In addition, the semiconductor device structure includes a base element over the collector element and in direct contact with the side surface of the semiconductor element.


Find Patent Forward Citations

Loading…