The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 01, 2019

Filed:

Oct. 21, 2015
Applicant:

Samsung Electronics Co., Ltd., Gyeonggi-do, KR;

Inventors:

Jorge A. Kittl, Round Rock, TX (US);

Borna J. Obradovic, Leander, TX (US);

Robert C. Bowen, Austin, TX (US);

Mark S. Rodder, Dallas, TX (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01); H01L 21/02 (2006.01); H01L 29/10 (2006.01); H01L 29/778 (2006.01);
U.S. Cl.
CPC ...
H01L 29/0669 (2013.01); H01L 21/0245 (2013.01); H01L 21/02463 (2013.01); H01L 21/02466 (2013.01); H01L 21/02505 (2013.01); H01L 21/02532 (2013.01); H01L 21/02546 (2013.01); H01L 21/02549 (2013.01); H01L 29/0665 (2013.01); H01L 29/1054 (2013.01); H01L 29/7782 (2013.01); H01L 29/7783 (2013.01); H01L 29/7781 (2013.01);
Abstract

Exemplary embodiments provide for fabricating a nanosheet stack structure having one or more sub-stacks. Aspects of the exemplary embodiments include: growing an epitaxial crystalline initial stack of one or more sub-stacks, each of the sub-stacks having at least three layers, a sacrificial layer A, and at least two different non-sacrificial layers B and C having different material properties, wherein the non-sacrificial layers B and C layers are kept below a thermodynamic or kinetic critical thickness corresponding to metastability during all processing, and wherein the sacrificial layer An is placed only at a top or a bottom of each of the sub-stacks, and each of the sub-stacks is connected to an adjacent sub-stack at the top or the bottom using one of the sacrificial layers A; proceeding with fabrication flow of nanosheet devices, such that pillar structures are formed at each end of the epitaxial crystalline stack that to hold the nanosheets in place after selective etch of the sacrificial layers; and selectively removing sacrificial layers A to all non-sacrificial layers B and C, while the remaining layers in the stack are held in place by the pillar structures so that after removal of the sacrificial layers An, each of the sub-stacks contains the non-sacrificial layers B and C.


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