The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 01, 2019

Filed:

Jul. 10, 2017
Applicant:

Shinko Electric Industries Co., Ltd., Nagano, JP;

Inventor:

Toyoaki Sakai, Nagano, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/498 (2006.01); H01L 23/13 (2006.01); H01L 23/00 (2006.01); H01L 25/10 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49827 (2013.01); H01L 23/13 (2013.01); H01L 23/49816 (2013.01); H01L 24/81 (2013.01); H01L 24/97 (2013.01); H01L 25/105 (2013.01); H05K 1/112 (2013.01); H01L 2224/13111 (2013.01);
Abstract

A wiring substrate includes an insulating layer and a wiring layer buried in the insulating layer at a first surface of the insulating layer. The wiring layer includes a first portion and a second portion. The first portion is narrower and thinner than the second portion. The first portion includes a first surface exposed at the first surface of the insulating layer. The second portion includes a first surface exposed at the first surface of the insulating layer and a second surface partly exposed in an opening formed in the insulating layer. The opening is open at a second surface of the insulating layer opposite to the first surface thereof.


Find Patent Forward Citations

Loading…