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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10170346 B1

PDFFull Text
Date of Patent:
Jan. 01, 2019

Filed:

Mar. 23, 2016

Resin sealing apparatus and resin sealing method

Applicant:

Towa Corporation, Kyoto-shi, Kyoto, JP;

Inventors:

Yohei Onishi, Kyoto, JP;

Takeaki Taka, Kyoto, JP;

Assignee:

TOWA CORPORATION, Kyoto-shi, Kyoto, JP;

Attorney:

Procopio, Cory, Hargreaves & Savitch LLP

Primary Examiner:

Robert B Davis

Int. Cl.
CPC ...
H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 21/67 (2006.01); B29C 33/42 (2006.01); B29C 43/02 (2006.01); B29C 43/18 (2006.01); B29C 43/56 (2006.01); B29L 31/34 (2006.01); B29C 33/44 (2006.01); B29C 43/36 (2006.01); B29C 43/50 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67126 (2013.01); B29C 33/42 (2013.01); B29C 43/021 (2013.01); B29C 43/18 (2013.01); B29C 43/56 (2013.01); H01L 21/565 (2013.01); B29C 33/44 (2013.01); B29C 43/36 (2013.01); B29C 43/361 (2013.01); B29C 43/50 (2013.01); B29C 2043/181 (2013.01); B29C 2043/182 (2013.01); B29C 2043/561 (2013.01); B29C 2043/565 (2013.01); B29L 2031/34 (2013.01); B29L 2031/3406 (2013.01); B29L 2031/3425 (2013.01);
Abstract

A lower mold has a bottom surface member and a side surface member. An upper end surface of the bottom surface member forms an inner bottom surface of a cavity and has a planar shape corresponding to an unusual planar shape of a sealing resin. A substrate is disposed on a mold surface of an upper mold such that a component to be sealed attached to the substrate faces downward, and the cavity is filled with a fluid resin. The upper mold and the lower mold are clamped, and the component is immersed in the fluid resin. The bottom surface member is raised, and the fluid resin is pressed at a prescribed resin pressure and cured to form the sealing resin. The bottom surface member and the side surface member are moved relatively, and thereby, a molded product is released from a mold surface of the lower mold.

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