The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 01, 2019
Filed:
Apr. 09, 2018
Applicant:
Taiwan Semiconductor Manufacturing Company Limited, Hsin-Chu, TW;
Inventors:
Sheng-Fang Cheng, New Taipei, TW;
Chen-Chih Wu, Hsinchu, TW;
Chien-Yuan Lee, Zhubei, TW;
Yen-Lin Liu, Taichung, TW;
Assignee:
Taiwan Semiconductor Manufacturing Company Limited, Hsin-Chu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/265 (2006.01); H01L 21/3205 (2006.01); H01L 29/78 (2006.01); H01L 29/423 (2006.01); H01L 29/06 (2006.01); H01L 21/8234 (2006.01); H01L 27/088 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 21/32051 (2013.01); H01L 21/265 (2013.01); H01L 21/32055 (2013.01); H01L 21/76877 (2013.01); H01L 21/823431 (2013.01); H01L 27/0886 (2013.01); H01L 29/0619 (2013.01); H01L 29/0623 (2013.01); H01L 29/0692 (2013.01); H01L 29/423 (2013.01); H01L 29/7851 (2013.01);
Abstract
Among other things, one or more semiconductor arrangements and techniques for forming such semiconductor arrangements are provided. A semiconductor arrangement comprises a first guard ring surrounding at least a portion of a device, and a first poly layer formed over the first guard ring.