The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 01, 2019
Filed:
Oct. 11, 2017
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Guy Cohen, Ossining, NY (US);
Pouya Hashemi, White Plains, NY (US);
Sanghoon Lee, Mohegan Lake, NY (US);
Alexander Reznicek, Troy, NY (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/033 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0332 (2013.01); H01L 21/0335 (2013.01); H01L 21/0337 (2013.01);
Abstract
A method of manufacturing a semiconductor device comprises forming a hydrogen silesquioxane (HSQ) layer on a semiconductor substrate, forming a cap layer on the HSQ layer, cross-linking a portion of the HSQ layer under the cap layer, and removing another portion of the HSQ layer which was not cross-linked.