The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 25, 2018

Filed:

Dec. 30, 2016
Applicant:

Foxconn Interconnect Technology Limited, Grand Cayman, KY;

Inventors:

Terrance F. Little, Fullerton, CA (US);

An-Jen Yang, Irvine, CA (US);

Jim Zhao, Irvine, CA (US);

Yuan Zhang, Rowland-Heights-CA, CA (US);

Jie Zheng, Rowland-Heights, CA (US);

Ke-Hao Chen, New Taipei, TW;

Yu Zhang, Kunshan, CN;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/42 (2006.01); H05K 7/20 (2006.01); H01R 24/00 (2011.01); H01R 12/72 (2011.01); H01L 23/467 (2006.01); H05K 5/00 (2006.01); H01R 13/66 (2006.01);
U.S. Cl.
CPC ...
H01R 12/721 (2013.01); G02B 6/4269 (2013.01); H01L 23/467 (2013.01); H01R 23/02 (2013.01); H05K 5/0047 (2013.01); H05K 7/20409 (2013.01); H05K 7/20436 (2013.01); H05K 7/20445 (2013.01); H01R 13/6658 (2013.01);
Abstract

A plug connector includes a metallic enclosure with a heat sink member exposed on an exterior surface to enclose a printed circuit board; a set of electronic components assembled upon the printed circuit board; a thermal pad sandwiched between the set of electronic components and the metallic enclosure to dissipate heat from the electronic component to the metallic enclosure and eventually to the air via the heat sink member; wherein a center of said heat sink member is essentially aligned with a center of said set of electronic components or a center of the thermal pad for efficient dissipation of heat.


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