The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 25, 2018

Filed:

Mar. 22, 2017
Applicant:

Stc.unm, Albuquerque, NM (US);

Inventors:

Steven R. J. Brueck, Albuquerque, NM (US);

Seung-Chang Lee, Albuquerque, NM (US);

Christian Wetzel, Troy, NY (US);

Mark Durniak, Troy, NY (US);

Assignee:

STC.UNM, Albuquerque, NM (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/778 (2006.01); H01L 21/02 (2006.01); H01L 21/306 (2006.01); H01L 29/66 (2006.01); H01L 29/205 (2006.01); H01L 29/08 (2006.01); H01L 21/78 (2006.01); H01L 29/04 (2006.01); H01L 29/423 (2006.01); H01L 29/06 (2006.01); H01L 33/00 (2010.01); H01L 33/32 (2010.01); H01L 29/40 (2006.01); H01L 33/24 (2010.01);
U.S. Cl.
CPC ...
H01L 29/7787 (2013.01); H01L 21/0243 (2013.01); H01L 21/0251 (2013.01); H01L 21/0254 (2013.01); H01L 21/02381 (2013.01); H01L 21/02395 (2013.01); H01L 21/02433 (2013.01); H01L 21/02458 (2013.01); H01L 21/02494 (2013.01); H01L 21/02502 (2013.01); H01L 21/02587 (2013.01); H01L 21/02609 (2013.01); H01L 21/30604 (2013.01); H01L 21/7806 (2013.01); H01L 29/04 (2013.01); H01L 29/0657 (2013.01); H01L 29/0847 (2013.01); H01L 29/205 (2013.01); H01L 29/42316 (2013.01); H01L 29/66462 (2013.01); H01L 29/045 (2013.01); H01L 29/402 (2013.01); H01L 33/007 (2013.01); H01L 33/0079 (2013.01); H01L 33/24 (2013.01); H01L 33/32 (2013.01);
Abstract

A transistor comprises a substrate comprising a Group III/V compound semiconductor material having a cubic crystalline phase structure positioned on a hexagonal crystalline phase layer having a first region and a second region, the cubic crystalline phase structure being positioned between the first region and the second region of the hexagonal crystalline phase layer. A source region and a drain region are both positioned in the Group III/V compound semiconductor material. A channel region is in the Group III/V compound semiconductor material. A gate is over the channel region. An optional backside contact can also be formed. A source contact and electrode are positioned to provide electrical contact to the source region. A drain contact and electrode are positioned to provide electrical contact to the drain region. Methods of forming transistors are also disclosed.


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