The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 25, 2018
Filed:
Jun. 02, 2016
Applicant:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Inventors:
Cheng-I Huang, Hsinchu, TW;
Ting-Wei Chiang, New Taipei, TW;
Shih-Chi Fu, Hsinchu County, TW;
Sheng-Fang Cheng, New Taipei, TW;
Jung-Chan Yang, Taoyuan, TW;
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 17/50 (2006.01); H01L 27/02 (2006.01); H01L 29/66 (2006.01); H01L 27/088 (2006.01); H01L 21/8234 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0207 (2013.01); G06F 17/5068 (2013.01); H01L 27/0886 (2013.01); H01L 29/66545 (2013.01); H01L 21/823431 (2013.01);
Abstract
A semiconductor device includes a substrate and fins. The fins are formed on a first area and a second area of the substrate. The first area includes a first recess. The second area is located with respect to the first area. The first recess is disposed at a side of the first area, and faces the second area. A projection area of the first recess on a side of the second area is substantially flat.