The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 25, 2018
Filed:
May. 18, 2018
Applicant:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Inventors:
Chih-Yu Lin, Taichung, TW;
Kao-Cheng Lin, Taipei, TW;
Li-Wen Wang, Taichung, TW;
Yen-Huei Chen, Hsinchu County, TW;
Assignee:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 25/065 (2006.01); H01L 27/06 (2006.01); G11C 5/06 (2006.01); G11C 7/18 (2006.01); H01L 27/10 (2006.01);
U.S. Cl.
CPC ...
H01L 23/481 (2013.01); G11C 5/063 (2013.01); G11C 7/18 (2013.01); H01L 25/0657 (2013.01); H01L 27/0688 (2013.01); H01L 27/10 (2013.01); H01L 2225/06541 (2013.01); H01L 2924/0002 (2013.01);
Abstract
An apparatus and method of three dimensional conductive lines comprising a first memory column segment in a first tier, a second memory column segment in a second tier, and conductive lines connecting the first memory column segment to the second memory column segment. In some embodiments a conductive line is disposed in the first tier on a first side of the memory column and in the second tier on a second side of the memory column.