The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 25, 2018

Filed:

Jun. 01, 2016
Applicant:

Bemis Company, Inc., Neenah, WI (US);

Inventors:

Michael S. Benthein, Neenah, WI (US);

Otacilio T. Berbert, Oshkosh, WI (US);

Assignee:

Bemis Company, Inc., Neenah, WI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B65D 81/20 (2006.01); B32B 7/14 (2006.01); B32B 27/08 (2006.01); B32B 27/32 (2006.01); B32B 27/34 (2006.01); B65D 75/26 (2006.01);
U.S. Cl.
CPC ...
B65D 81/2023 (2013.01); B32B 7/14 (2013.01); B32B 27/08 (2013.01); B32B 27/32 (2013.01); B32B 27/34 (2013.01); B65D 75/26 (2013.01); B32B 2250/24 (2013.01); B32B 2307/72 (2013.01); B32B 2439/46 (2013.01);
Abstract

A package film comprising a biaxially oriented film and pattern connection layer is described. The package film comprises an exterior layer comprising a biaxially oriented film. The biaxially oriented film is a biaxially oriented nylon film or a biaxially oriented polyethylene terephthalate film. The package film also comprises an interior layer comprising a sealant film, and a pattern connection layer positioned between and directly adjacent each of the exterior layer and the interior layer. The pattern connection layer comprises a solvent-based adhesive or a water-based adhesive. The package film has a secant modulus greater than 120,000 psi and an elongation at break of less than 150%. The package film is adapted to form an evacutable storage bag. Various embodiments of the package films are also described.


Find Patent Forward Citations

Loading…