The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 25, 2018
Filed:
Nov. 12, 2015
Applicant:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Inventors:
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 49/14 (2006.01); B24B 37/20 (2012.01); B24B 37/015 (2012.01); B24B 55/02 (2006.01); B24B 7/22 (2006.01);
U.S. Cl.
CPC ...
B24B 37/20 (2013.01); B24B 37/015 (2013.01); B24B 49/14 (2013.01); B24B 55/02 (2013.01); B24B 7/228 (2013.01);
Abstract
A chemical mechanical polishing (CMP) apparatus includes a processing chamber, a platen, a wafer heater and a carrier head. The platen is disposed in the processing chamber and is configured to allow a polishing pad to be disposed thereon. The wafer heater is disposed in the processing chamber and is configured to heat a wafer. The carrier head is disposed in the processing chamber and is configured to hold the heated wafer against the polishing pad.