The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 18, 2018
Filed:
Dec. 21, 2015
Intel Corporation, Santa Clara, CA (US);
Ladd D. Campbell, Chandler, AZ (US);
Scott M. Mokler, Hillsboro, OR (US);
Juan Landeros, Jr., Hillsboro, OR (US);
Michael J. Hill, Gilbert, AZ (US);
Jin Zhao, San Jose, CA (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Embodiments of the invention include a printed circuit board (PCB) assembly that includes advanced component in cavity (ACC) technology and methods of forming such PCB assemblies. In one embodiment, the PCB assembly may include a PCB that has a cavity formed on a first surface of the PCB. A plurality of contacts may be formed in the cavity. The cavity provides a location where components may be electrically coupled to the PCB. Additionally, a package that is mounted to the PCB may extend over the cavity. Since the package passes directly over the component, the components may be used to electrically couple the package to one or more of the contacts formed in the cavity. Accordingly, embodiments of the invention allow for the surface area used for components to be reduced, and also improves electrical performance of the PCB assembly by positioning the components proximate to the package.