The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 18, 2018
Filed:
Aug. 31, 2016
Applicants:
Stmicroelectronics, Inc., Coppell, TX (US);
Stmicroelectronics S.r.l., Agrate Brianza, IT;
Inventors:
Simon Dodd, West Linn, OR (US);
Roberto Brioschi, Sesto San Giovanni, IT;
Assignees:
STMICROELECTRONICS, INC., Coppell, TX (US);
STMICROELECTRONICS S.R.L., Agrate Brianza, IT;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 1/11 (2006.01); H05K 1/03 (2006.01); H05K 3/40 (2006.01); H05K 3/10 (2006.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); H05K 1/0306 (2013.01); H05K 1/111 (2013.01); H05K 3/10 (2013.01); H05K 3/4007 (2013.01); H05K 2201/10083 (2013.01); H05K 2201/10159 (2013.01); H05K 2201/10181 (2013.01);
Abstract
The present disclosure is directed to a ceramic substrate that includes a plurality of contact pads, a plurality of electrical traces, and a microelectromechanical die. Contacts on the die are coupled to the plurality of contact pads through the plurality of electrical traces. The substrate also includes a plurality of memory bits formed directly on the substrate. Each memory bit is coupled between a first one of the contact pads and a second one of the contact pads.