The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 18, 2018

Filed:

Aug. 20, 2015
Applicant:

Renesas Electronics Corporation, Tokyo, JP;

Inventors:

Shuuichi Kariyazaki, Tokyo, JP;

Wataru Shiroi, Tokyo, JP;

Kenichi Kuboyama, Kodaira, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01); H05K 1/02 (2006.01); H01L 23/32 (2006.01); H01L 25/04 (2014.01); H01L 25/18 (2006.01); H05K 1/14 (2006.01); H05K 3/40 (2006.01); H05K 1/18 (2006.01); H05K 1/11 (2006.01); H05K 1/16 (2006.01); H05K 7/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0248 (2013.01); H01L 23/32 (2013.01); H01L 25/04 (2013.01); H01L 25/18 (2013.01); H05K 1/0298 (2013.01); H05K 1/113 (2013.01); H05K 1/119 (2013.01); H05K 1/141 (2013.01); H05K 3/4046 (2013.01); H01L 2224/16225 (2013.01); H05K 1/11 (2013.01); H05K 1/16 (2013.01); H05K 1/18 (2013.01); H05K 1/181 (2013.01); H05K 1/182 (2013.01); H05K 7/02 (2013.01); H05K 2201/09218 (2013.01);
Abstract

A semiconductor device according to an embodiment has a first semiconductor component and a second semiconductor component which are electrically connected with each other via an interposer. The interposer has a plurality of first signal wiring paths, and a plurality of second signal wiring paths each having a path distance smaller than each of the plurality of first signal wiring paths. Furthermore, the first semiconductor component includes a first electrode, a second electrode, and a third electrode arranged in order in a first direction. Furthermore, the second semiconductor component includes a fourth electrode, a fifth electrode, and a sixth electrode arranged in order in the first direction. Furthermore, the first electrode is connected with the fourth electrode via the first signal wiring path, the second electrode is connected with the fifth electrode via the first signal wiring path, and the third electrode is connected with the sixth electrode via the first signal wiring path.


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