The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 18, 2018

Filed:

Aug. 22, 2017
Applicant:

Infineon Technologies Austria Ag, Villach, AT;

Inventors:

Daniel Tutuc, St. Niklas an der Drau, AT;

Christian Fachmann, Fürnitz, AT;

Franz Hirler, Isen, DE;

Maximilian Treiber, Munich, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01); H01L 21/225 (2006.01); H01L 21/265 (2006.01); H01L 21/324 (2006.01); H01L 29/10 (2006.01); H01L 29/66 (2006.01); H01L 29/78 (2006.01);
U.S. Cl.
CPC ...
H01L 29/0634 (2013.01); H01L 21/2253 (2013.01); H01L 21/26513 (2013.01); H01L 21/324 (2013.01); H01L 29/0619 (2013.01); H01L 29/1095 (2013.01); H01L 29/66712 (2013.01); H01L 29/7811 (2013.01);
Abstract

A field-effect semiconductor device includes a semiconductor body having a first semiconductor region of a first conductivity type, a first side, an edge delimiting the semiconductor body in a direction substantially parallel to the first side, an active area, and a peripheral area arranged between the active area and the edge. A first metallization is arranged on the first side, and a second metallization is arranged opposite the first metallization and in Ohmic connection with the first semiconductor region. In the active area, the semiconductor body further includes: a plurality of drift portions of the first conductivity type alternating with compensation regions of a second conductivity type, the drift portions being in Ohmic connection with the first semiconductor region, the compensation regions being in Ohmic connection with the first metallization and having in a vertical direction perpendicular to the first side a vertical extension.


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