The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 18, 2018
Filed:
Nov. 16, 2016
Winbond Electronics Corp., Taichung, TW;
Chun-Hsu Chen, Taichung, TW;
Hsu-Chi Cho, Taichung, TW;
Winbond Electronics Corp., Taichung, TW;
Abstract
A method for fabricating a memory device is provided. In the method, a first gate dielectric layer is formed on a substrate in a first region. A second gate dielectric layer is formed on the substrate in a second region and a third region. A first conductive layer is formed on the substrate. A first dielectric layer is directly formed on the first conductive layer. One portion of the first dielectric layer, one portion of the first conductive layer, and one portion of the second gate dielectric layer in the second region are removed. A third gate dielectric layer and a second conductive layer are formed sequentially on the substrate in the second region. A third conductive layer and a second dielectric layer are formed sequentially on the substrate. Isolation structures are formed in the substrate. Here, the isolation structures penetrate the second dielectric layer and extend into the substrate.