The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 18, 2018
Filed:
Dec. 03, 2015
Applicant:
Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;
Inventors:
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/02 (2006.01); H01L 23/522 (2006.01); H01L 23/528 (2006.01); H01L 27/092 (2006.01); H01L 29/10 (2006.01); H01L 29/78 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0292 (2013.01); H01L 23/528 (2013.01); H01L 23/5226 (2013.01); H01L 27/092 (2013.01); H01L 29/1079 (2013.01); H01L 29/78 (2013.01);
Abstract
An integrated circuit (IC) structure is provided. The IC structure comprises a deep n-well (DWN), a first circuit, a second circuit, a first power line and a second power line. The first circuit is in the DWN. The second circuit is outside the DWN and electrically connected with the first circuit. The first power line is configured to provide the first circuit with power. The second power line is configured to provide the second circuit with power. The second power line is electrically connected with the first power line. The first power line and the second power line are in different conductive layers.