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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10157885 B1

PDFFull Text
Date of Patent:
Dec. 18, 2018

Filed:

Jul. 29, 2016

Package structure having magnetic bonding between substrates

Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Peter Yu-Fei Huang, Pleasanton, CA (US);

Richard Burton Cassidy, II, Los Gatos, CA (US);

Chaochieh Tsai, Cupertino, CA (US);

Assignee:

TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu, TW;

Attorney:

McClure, Qualey & Rodack, LLP

Primary Examiner:

Shouxiang Hu

Int. Cl.
CPC ...
H01L 29/40 (2006.01); H01L 25/065 (2006.01); H01L 25/00 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 21/78 (2006.01); H01L 21/66 (2006.01); H01L 23/48 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 21/76898 (2013.01); H01L 21/78 (2013.01); H01L 22/20 (2013.01); H01L 23/481 (2013.01); H01L 23/49816 (2013.01); H01L 23/49827 (2013.01); H01L 24/05 (2013.01); H01L 24/09 (2013.01); H01L 24/13 (2013.01); H01L 24/14 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 25/0652 (2013.01); H01L 25/50 (2013.01); H01L 2224/10165 (2013.01); H01L 2924/01026 (2013.01); H01L 2924/01027 (2013.01); H01L 2924/01028 (2013.01);
Abstract

A package structure and method for forming the same are provided. The package structure includes a first die, and the first die includes a first magnetic pad formed over a first substrate. The package structure includes a second die, and the second die includes a second magnetic pad formed over a second substrate. The package structure also includes a hybrid bonding structure formed between the first die and the second die of the second wafer. The hybrid bonding structure includes a magnetic bonding structure which is made of the first magnetic pad and the second magnetic layer.

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Quick Actions:

Huang, Peter Yu-Fei. (2018). Package structure having magnetic bonding between substrates (U.S. Patent No. 10157885). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10157885

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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