The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 18, 2018
Filed:
Jan. 04, 2018
Applicant:
Adeka Corporation, Tokyo, JP;
Inventors:
Atsushi Sakurai, Tokyo, JP;
Masako Hatase, Tokyo, JP;
Naoki Yamada, Tokyo, JP;
Tsubasa Shiratori, Tokyo, JP;
Akio Saito, Tokyo, JP;
Tomoharu Yoshino, Tokyo, JP;
Assignee:
ADEKA CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C07C 251/08 (2006.01); C07F 15/06 (2006.01); C07C 251/04 (2006.01); C07F 1/08 (2006.01); C07F 15/04 (2006.01); C23C 16/18 (2006.01); C23C 16/40 (2006.01); C07F 7/28 (2006.01);
U.S. Cl.
CPC ...
C07F 15/065 (2013.01); C07C 251/04 (2013.01); C07C 251/08 (2013.01); C07F 1/08 (2013.01); C07F 15/045 (2013.01); C23C 16/18 (2013.01); C23C 16/406 (2013.01); C23C 16/408 (2013.01); C07F 7/28 (2013.01);
Abstract
An alcohol compound of formula (II) in which Rrepresents a methyl group or an ethyl group, Rrepresents a hydrogen atom, and Rrepresents a Clinear or branched alkyl group. The alcohol compound has physical properties suitable for a material for forming thin films by CVD, and particularly, physical properties suitable for a material for forming metallic-copper thin films.