The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 11, 2018
Filed:
Oct. 01, 2015
Applicant:
Rohm and Haas Electronic Materials Llc, Marlborough, MA (US);
Inventors:
Nagarajan Jayaraju, Framingham, MA (US);
Leon R. Barstad, Raynham, MA (US);
Elie H. Najjar, Norwood, MA (US);
Assignee:
Rohm and Haas Electronic Materials LLC, Marlborough, MA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/42 (2006.01); C25D 5/18 (2006.01); C25D 7/00 (2006.01); C25D 3/38 (2006.01); C23C 18/16 (2006.01);
U.S. Cl.
CPC ...
H05K 3/424 (2013.01); C25D 5/18 (2013.01); C25D 7/00 (2013.01); H05K 3/423 (2013.01); C23C 18/1653 (2013.01); C25D 3/38 (2013.01); H05K 2201/09563 (2013.01); H05K 2203/1492 (2013.01);
Abstract
Pulse plating methods which include a forward pulse but no reverse pulse inhibit or reduce dimpling and voids during copper electroplating of through-holes in substrates such as printed circuit boards. The pulse plating methods may be used to fill through-holes with copper where the through-holes are coated with electroless copper or flash copper.