The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 11, 2018

Filed:

Dec. 20, 2016
Applicant:

Cirocomm Technology Corp., Tainan, TW;

Inventors:

Shin-Hui Chou, Tainan, TW;

Chin-Hao Chen, Tainan, TW;

Yue-Cheng Jhong, Tainan, TW;

Yi-Ching Lin, Tainan, TW;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01P 1/205 (2006.01); H01P 1/20 (2006.01); H01P 7/06 (2006.01);
U.S. Cl.
CPC ...
H01P 1/2056 (2013.01); H01P 1/2002 (2013.01); H01P 1/205 (2013.01); H01P 7/065 (2013.01);
Abstract

A filter structure improvement includes a substrate, resonance layers, a grounded layer, a pattern layer, an input electrode, and an output electrode. The substrate has resonance holes in which the resonance layers are disposed. One end of the resonance hole is on the open surface and the other end of the resonance hole is on the short-circuit surface. The grounded layer is on the short-circuit surface, top surface, bottom surface, and side surfaces and is electrically connected to the resonance layers to form a short-circuit end. The input and output electrodes, electrically isolated from the grounded layer, are on the bottom or open surface of the substrate. The pattern layer, resonance layers, and grounded layer are arranged to have electrical properties of a filter structure of mutual coupling such that a desired frequency band is obtained by adjusting the pattern layer and the lengths of the resonance layers.


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