The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 11, 2018
Filed:
Jul. 20, 2017
Macronix International Co., Ltd., Hsinchu, TW;
Chi-Hao Huang, Hsinchu, TW;
Chin-Cheng Yang, Hsinchu, TW;
MACRONIX International Co., Ltd., Hsinchu, TW;
Abstract
An interconnect structure including a first dielectric layer, a first conductive layer, a second conductive layer, a capping layer, and a via is provided. The first dielectric layer has a first trench and a second trench. The first conductive layer is located in the first trench. The second conductive layer is located in the second trench, and a top surface of the second conductive layer is lower than a top surface of the first dielectric layer. The capping layer having a via opening exposing a portion of the first conductive layer covers the first dielectric layer, the first conductive layer, and the second conductive layer. The via located on the first conductive layer and the first dielectric layer located between the first conductive layer and the second conductive layer is filled into the via opening and electrically connected to the first conductive layer.