The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 04, 2018

Filed:

Mar. 03, 2017
Applicant:

United Silicon Carbide, Inc., Monmouth Junction, NJ (US);

Inventor:

Xing Huang, Ewing, NJ (US);

Assignee:

United Silicon Carbide, Inc., Monmouth Junction, NJ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/15 (2006.01); H01L 31/0312 (2006.01); H01L 29/78 (2006.01); H01L 29/16 (2006.01); H01L 29/20 (2006.01); H01L 29/24 (2006.01); H01L 29/66 (2006.01); H01L 29/739 (2006.01); H01L 29/423 (2006.01); H01L 29/08 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7813 (2013.01); H01L 29/0834 (2013.01); H01L 29/1602 (2013.01); H01L 29/1608 (2013.01); H01L 29/2003 (2013.01); H01L 29/24 (2013.01); H01L 29/4236 (2013.01); H01L 29/66356 (2013.01); H01L 29/66734 (2013.01); H01L 29/7391 (2013.01); H01L 29/7802 (2013.01); H01L 29/7828 (2013.01);
Abstract

A tunneling field-effect transistor with an insulated planar gate adjacent to a heterojunction between wide-bandgap semiconductor, such as silicon carbide, and either a narrow band gap material or a high work function metal. The heterojunction may be formed by filling a recess on a silicon carbide planar substrate, for example by etched into an epitaxially grown drift region atop the planar substrate. The low band gap material may be silicon which is deposited heterogeneously and, optionally, annealed via laser treatment and/or doped. The high work function metal may be tungsten, platinum, titanium, nickel, tantalum, or gold, or an alloy containing such a metal. The plane of the gate may be lateral or vertical. A blocking region of opposite doping type from the drift prevents conduction from the filled recess to the drift other than the conduction though the heterojunction.


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