The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 04, 2018

Filed:

Sep. 26, 2017
Applicant:

Nxp Usa, Inc., Austin, TX (US);

Inventors:

Charles John Lessard, Gilbert, AZ (US);

Damon G. Holmes, Scottsdale, AZ (US);

David Cobb Burdeaux, Tempe, AZ (US);

Hernan Rueda, Chandler, AZ (US);

Ibrahim Khalil, Gilbert, AZ (US);

Assignee:

NXP USA, Inc., Austin, TX (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/58 (2006.01); H01L 23/552 (2006.01); H01L 23/66 (2006.01); H01L 23/48 (2006.01); H01L 23/528 (2006.01); H01L 23/522 (2006.01); H01L 21/768 (2006.01); H01L 29/78 (2006.01); H03F 1/02 (2006.01); H03F 3/195 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 21/76877 (2013.01); H01L 23/481 (2013.01); H01L 23/528 (2013.01); H01L 23/5226 (2013.01); H01L 23/66 (2013.01); H01L 29/78 (2013.01); H01L 2223/6616 (2013.01); H01L 2223/6655 (2013.01); H03F 1/0288 (2013.01); H03F 3/195 (2013.01); H03F 2200/222 (2013.01); H03F 2200/225 (2013.01); H03F 2200/387 (2013.01); H03F 2200/391 (2013.01); H03F 2200/451 (2013.01);
Abstract

A transistor includes a semiconductor substrate having an intrinsic active device, a first terminal, and a second terminal. The transistor also includes an interconnect structure formed of layers of dielectric material and electrically conductive material on the semiconductor substrate. The interconnect structure includes a pillar, a tap interconnect, and a shield structure positioned between the pillar and the tap interconnect formed from the electrically conductive material and extending through the dielectric material. The pillar contacts the first terminal and connects to a first runner. The tap interconnect contacts the second terminal and connects to a second runner. The shield structure includes a base segment, a first leg, and a second leg extending from opposing ends of the base segment, wherein the first and second legs extend from opposing ends of the base segment in a direction that is antiparallel to a length of the base segment.


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