The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 04, 2018

Filed:

Nov. 27, 2013
Applicant:

Taiwan Semiconductor Manufacturing Company Limited, Hsinchu, TW;

Inventors:

Chih-Wei Huang, Hsinchu, TW;

Feng-Ning Lee, Taoyuan County, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G05B 19/418 (2006.01); G05B 23/02 (2006.01);
U.S. Cl.
CPC ...
G05B 19/418 (2013.01); G05B 23/024 (2013.01); G05B 2219/32191 (2013.01); G05B 2219/42001 (2013.01); G05B 2219/45031 (2013.01); Y02P 90/02 (2015.11); Y02P 90/22 (2015.11);
Abstract

A method for monitoring a process in a semiconductor processing facility and a monitor system are provided. A plurality of wafers are processed according to a process. Data on the processing is collected, and the collecting includes, for each wafer of the plurality of wafers, determining that a processing event has occurred, and recording a time associated with the processing event. An amount of time between the recorded times is calculated for consecutively processed wafers. A set of control limits for the process is determined based on the calculated amounts of time. The set of control limits define a range of acceptable values for the amount of time. Second wafers are processed according to the process. A problem in the processing of the second wafers is identified based on the set of control limits. The problem is identified as the second wafers are being processed.


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