The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 04, 2018

Filed:

Nov. 10, 2017
Applicant:

Lam Research Corporation, Fremont, CA (US);

Inventors:

Sunil Kapoor, Vancouver, WA (US);

Karl F. Leeser, West Linn, OR (US);

Adrien LaVoie, Newberg, OR (US);

Yaswanth Rangineni, Tigard, OR (US);

Assignee:

Lam Research Corporation, Fremont, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/455 (2006.01); C23C 16/52 (2006.01); C23C 16/505 (2006.01); H01J 37/32 (2006.01); H01J 21/02 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
C23C 16/45544 (2013.01); C23C 16/45536 (2013.01); C23C 16/505 (2013.01); C23C 16/52 (2013.01); H01J 37/3244 (2013.01); H01J 37/32082 (2013.01); H01J 37/32155 (2013.01); H01J 37/32183 (2013.01); H01J 37/32889 (2013.01); H01J 37/32899 (2013.01); H01J 37/32935 (2013.01); H01L 21/0262 (2013.01); C23C 16/45525 (2013.01); C23C 16/45538 (2013.01); H01J 2237/3321 (2013.01);
Abstract

Apparatuses for multi-station semiconductor deposition operations with RF power frequency tuning are disclosed. The RF power frequency may be tuned according to a measured impedance of a plasma during the semiconductor deposition operation. In certain implementations of the apparatuses, a RF power parameter may be adjusted during or prior to the deposition operation. Certain other implementations of the semiconductor deposition operations may include multiple different deposition processes with corresponding different recipes. The recipes may include different RF power parameters for each respective recipe. The respective recipes may adjust the RF power parameter prior to each deposition process. RF power frequency tuning may be utilized during each deposition process.


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