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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10144824 B1

PDFFull Text
Date of Patent:
Dec. 04, 2018

Filed:

Dec. 02, 2014

Halogen free resin composition and prepreg and laminated board prepared therefrom

Applicant:

Shengyi Technology Co., Ltd., Dongguan, CN;

Inventors:

Hui Li, Dongguan, CN;

Kehong Fang, Dongguan, CN;

Assignee:

SHENGYI TECHNOLOGY CO., LTD., , CN;

Attorney:

McDonald Hopkins LLC

Primary Examiner:

Mark Kopec

Int. Cl.
CPC ...
C08L 63/00 (2006.01); C08G 59/00 (2006.01); C08L 63/08 (2006.01); C08L 71/12 (2006.01); C08G 59/58 (2006.01); C08J 5/04 (2006.01); C08J 5/24 (2006.01); H05K 1/03 (2006.01); C08G 59/42 (2006.01); C08K 3/36 (2006.01); C08K 5/00 (2006.01); C08K 5/3445 (2006.01); C08K 5/49 (2006.01); C08L 35/06 (2006.01); C08L 63/04 (2006.01); B32B 15/092 (2006.01);
U.S. Cl.
CPC ...
C08L 63/08 (2013.01); C08G 59/42 (2013.01); C08G 59/58 (2013.01); C08J 5/043 (2013.01); C08J 5/24 (2013.01); C08K 3/36 (2013.01); C08K 5/0066 (2013.01); C08K 5/3445 (2013.01); C08K 5/49 (2013.01); C08L 35/06 (2013.01); C08L 63/00 (2013.01); C08L 63/04 (2013.01); C08L 71/12 (2013.01); H05K 1/0373 (2013.01); B32B 15/092 (2013.01); C08J 2363/02 (2013.01); C08J 2363/08 (2013.01); C08J 2425/02 (2013.01); C08J 2435/00 (2013.01); C08J 2471/12 (2013.01); C08L 2201/02 (2013.01); C08L 2201/22 (2013.01); C08L 2203/20 (2013.01); C08L 2205/02 (2013.01); C08L 2205/03 (2013.01); C08L 2205/05 (2013.01); C08L 2312/00 (2013.01); H05K 2201/012 (2013.01);
Abstract

The present invention relates to a halogen-free resin composition and a prepreg and a laminated board prepared therefrom. The halogen-free resin composition contains the following components in parts by weight: 50-100 parts of an epoxy resin; 20-70 parts of benzoxazine; 5-40 parts of a polyphenyl ether; 5-40 parts of allyl benzene-maleic anhydride; 10-60 parts of a halogen-free flame retardant; 0.2-5 parts of a curing accelerator, and 20-100 parts of a filler. The prepreg and laminated board prepared from the halogen-free resin composition have comprehensive performances such as a low dielectric constant, a low dielectric loss, an excellent flame retardance, heat resistance, cohesiveness and moisture resistance, etc., and are suitable for use in a halogen-free high multilayer circuit board.

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