The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 27, 2018
Filed:
Feb. 16, 2016
Ibiden Co., Ltd., Ogaki, JP;
Yukinobu Mikado, Ogaki, JP;
Mitsuhiro Tomikawa, Ogaki, JP;
Koji Asano, Ogaki, JP;
Kotaro Takagi, Ogaki, JP;
IBIDEN CO., LTD., Ogaki, JP;
Abstract
A circuit substrate includes a core substrate having a cavity penetrating through the substrate, a metal block accommodated in the cavity of the substrate, a first build-up layer laminated on first side of the substrate and including insulating resin layers such that the first build-up layer is covering first surface of the block from the first side, and a second build-up layer laminated on second side of the substrate and including insulating resin layers such that the second build-up layer is covering second surface of the block from the second side. The first build-up layer includes an electronic component mounting structure formed on outermost portion of the first build-up layer, and the block is formed such that the first and second surfaces have roughened surfaces, respectively, and that the roughened surface of the first surface has surface roughness different from surface roughness of the roughened surface of the second surface.