The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 27, 2018

Filed:

Dec. 13, 2012
Applicant:

Lg Innotek Co., Ltd., Seoul, KR;

Inventor:

Dong Geun Shin, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C01B 32/956 (2017.01); C01B 31/36 (2006.01); C04B 35/565 (2006.01); C04B 35/626 (2006.01); B82Y 30/00 (2011.01);
U.S. Cl.
CPC ...
C01B 31/36 (2013.01); B82Y 30/00 (2013.01); C01B 32/956 (2017.08); C04B 35/565 (2013.01); C04B 35/62655 (2013.01); C01P 2004/61 (2013.01); C01P 2004/62 (2013.01); C04B 2235/5427 (2013.01); C04B 2235/5436 (2013.01); C04B 2235/5445 (2013.01); C04B 2235/5454 (2013.01); C04B 2235/6567 (2013.01); C04B 2235/72 (2013.01);
Abstract

A method of fabricating silicon carbide powder according to the first embodiment includes preparing a silicon carbide molded member by molding a silicon carbide material; preparing a silicon carbide agglomerate member by pulverizing the silicon carbide molded member; and preparing the silicon carbide powder by heat-treating the silicon carbide agglomerate member. A method of fabricating silicon carbide powder according to the second embodiment includes preparing a primary material having a first grain size and including silicon carbide; preparing a secondary material having a second grain size by agglomerating the primary material; and preparing the silicon carbide powder by heat-treating the secondary material.


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