The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 27, 2018
Filed:
May. 26, 2016
Senju Metal Industry Co., Ltd., Tokyo, JP;
Manabu Muraoka, Tochigi, JP;
Takeo Saitoh, Tochigi, JP;
Shigeyuki Sekine, Tochigi, JP;
Takashi Obayashi, Tochigi, JP;
Kaichi Tsuruta, Tochigi, JP;
Takashi Hagiwara, Tochigi, JP;
Hiroyuki Yamasaki, Tochigi, JP;
Kota Kikuchi, Tokyo, JP;
Naoto Kameda, Tochigi, JP;
Senju Metal Industry Co., Ltd., Tokyo, JP;
Abstract
In the flux applying device, a control portion controls conveying rollers or the like so that thickness of flux applied to solder is controlled. The winding roller rotates so that the solder is conveyed at the conveying speed. The drawing-out roller applies any load (back tension) to the solder backward along the conveying direction of the solder when drawing out the solder. The solder is conveyed at the predetermined speed and dipped into the flux tank containing flux. The solder is pulled up from the flux tank at the conveying speed vertically. By pulling up the solder from the flux tank at the constant conveying speed vertically, the interfacial tension acts on the solderand the flux, so that the flux having a uniform thickness according to the conveying speed remains on the surface and back surface of the solder.