The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 20, 2018

Filed:

Nov. 03, 2016
Applicant:

Massachusetts Institute of Technology, Cambridge, MA (US);

Inventors:

William D. Oliver, Arlington, MA (US);

Andrew J. Kerman, Arlington, MA (US);

Rabindra N. Das, Lexington, MA (US);

Donna-Ruth W. Yost, Acton, MA (US);

Danna Rosenberg, Arlington, MA (US);

Mark A. Gouker, Belmont, MA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 39/22 (2006.01); G06N 99/00 (2010.01); H01L 39/02 (2006.01); H01L 25/065 (2006.01); H01L 27/18 (2006.01);
U.S. Cl.
CPC ...
H01L 39/223 (2013.01); G06N 99/002 (2013.01); H01L 25/0657 (2013.01); H01L 27/18 (2013.01); H01L 39/025 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/15192 (2013.01);
Abstract

A cryogenic quantum bit package with multiple qubit circuits facilitates inter-qubit signal propagation using a multi-chip module (MCM). Multiple qubits are grouped within the package into one or more qubit integrated circuits (ICs). The qubit ICs themselves are electrically coupled to each other via a structure including a superconducting MCM and superconducting interconnects. Coupling of quantum electrical signals between a qubit and other qubits, a substrate, or the MCM uses a coupler circuit, such as a Josephson junction, capacitor, inductor, or resonator.


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