The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 20, 2018
Filed:
Feb. 19, 2016
Asm Technology Singapore Pte Ltd, Singapore, SG;
Guido Knippels, RA Schijndel, NL;
Geert Ubink, TK's Hertogenbosch, NL;
Jianfei Yang, AZ Eindhoven, NL;
Eric Meng Meng Tan, AB Wageningen, NL;
Marcel Boeren, BE Goirle, NL;
ASM TECHNOLOGY SINGAPORE PTE LTD, Singapore, SG;
Abstract
A wafer cutting apparatus comprises a wafer positioning device for holding a wafer that is substantially covered with an opaque material such as molding compound and that has an exposed peripheral area, and for displacing the wafer relative to a wafer inspection system comprising a camera having a field of view. To perform visual data acquisition of said dicing street portions, the wafer is displaced such that a center of the camera's field of view follows a path along the exposed peripheral area of the wafer. A processing unit analyzes the visual data acquired for detecting or calculating locations and directions of the dicing streets. A wafer cutting tool cuts the wafer along straight lines between the dicing street portions which have been detected or calculated by the processing unit.