The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 20, 2018

Filed:

Mar. 08, 2017
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Kadthala Ramaya Narendrnath, San Jose, CA (US);

Gangadhar Sheelavant, Karnataka, IN;

Monika Agarwal, Fremont, CA (US);

Ashish Bhatnagar, Fremont, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 7/12 (2006.01); B32B 7/14 (2006.01); H01L 21/67 (2006.01); H01L 21/683 (2006.01); H01L 21/687 (2006.01); B32B 37/12 (2006.01);
U.S. Cl.
CPC ...
B32B 37/1292 (2013.01); B32B 7/14 (2013.01); H01L 21/67005 (2013.01); H01L 21/67092 (2013.01); H01L 21/6831 (2013.01); H01L 21/6833 (2013.01); H01L 21/6835 (2013.01); H01L 21/68785 (2013.01); H01L 21/67109 (2013.01); H01L 2221/68318 (2013.01); H01L 2221/68381 (2013.01); H01L 2224/2732 (2013.01); H01L 2224/27318 (2013.01); H01L 2224/27436 (2013.01); H01L 2224/27438 (2013.01); H01L 2224/29011 (2013.01); H01L 2224/29012 (2013.01); H01L 2224/29013 (2013.01); H01L 2224/29014 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/29078 (2013.01); H01L 2224/29191 (2013.01); H01L 2224/83862 (2013.01); H01L 2224/83877 (2013.01); H01L 2224/98 (2013.01); H01L 2924/15151 (2013.01); Y10T 156/10 (2015.01); Y10T 279/23 (2015.01); Y10T 428/24851 (2015.01);
Abstract

Methods for fabricating and refurbishing an assembly are disclosed herein. The method begins by applying an adhesive layer onto a first substrate. A second substrate is placed onto the adhesive layer, thereby securing the two substrates together, the adhesive layer bounding at least one side of a channel that extends laterally between the substrates to an exterior of the assembly. And, the substrates and the adhesive layer are subjected to a bonding procedure and allowing outgassing of volatiles from the adhesive layer to escape from between the substrates through the channel, wherein the substrates bonded by the adhesive layer form a component for a semiconductor vacuum processing chamber.


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