The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10128233 B1

PDF
Full Text
Expired
Date of Patent:
Nov. 13, 2018

Filed:

Aug. 19, 2016
Applicant:

Synaptics Japan Gk, Tokyo, JP;

Inventors:

Masashi Oura, Tokyo, JP;

Yasuhiro Fujii, Tokyo, JP;

Assignee:

Synaptics Japan GK, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/66 (2006.01); H01L 27/088 (2006.01); H01L 21/8234 (2006.01);
U.S. Cl.
CPC ...
H01L 27/088 (2013.01); H01L 21/8234 (2013.01); H01L 29/66545 (2013.01);
Abstract

A semiconductor device includes a first structure component comprising a first transistor, a first dummy pattern, a second structure component comprising a second transistor and a second dummy pattern. The first structure component and the first dummy pattern have a first height, and the second structure component and the second dummy pattern have a second height lower than the first height.


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Oura, Masashi. (2018). Semiconductor device and semiconductor device manufacturing method (U.S. Patent No. 10128233). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10128233

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