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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10128201 B1

PDFFull Text
Date of Patent:
Nov. 13, 2018

Filed:

Feb. 16, 2017

Seal ring for wafer level package

Applicant:

Globalfoundries Singapore Pte. Ltd., Singapore, SG;

Inventors:

Shunqiang Gong, Singapore, SG;

Juan Boon Tan, Singapore, SG;

Shan Gao, Singapore, SG;

Assignee:

GLOBALFOUNDRIES SINGAPORE PTE. LTD., Singapore, SG;

Attorney:

Horizon IP Pte Ltd.

Primary Examiner:

Thanhha Pham

Int. Cl.
CPC ...
H01L 23/58 (2006.01); H01L 23/31 (2006.01); H01L 23/52 (2006.01); H01L 21/768 (2006.01); H01L 21/56 (2006.01); H01L 23/528 (2006.01); H01L 23/522 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/585 (2013.01); H01L 21/565 (2013.01); H01L 21/76895 (2013.01); H01L 23/3114 (2013.01); H01L 23/528 (2013.01); H01L 23/5226 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 2224/0231 (2013.01); H01L 2224/0239 (2013.01); H01L 2224/02379 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/13023 (2013.01); H01L 2224/13024 (2013.01); H01L 2224/211 (2013.01); H01L 2924/01022 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01073 (2013.01); H01L 2924/04941 (2013.01); H01L 2924/04953 (2013.01); H01L 2924/35 (2013.01); H01L 2924/351 (2013.01); H01L 2924/35121 (2013.01);
Abstract

Devices and methods for forming a device are disclosed. At least one die is provided. A redistribution layer having a fan-out region extends concentrically outwards from an outer perimeter of the at least one die. A seal ring is disposed in the fan-out region of the redistribution layer.

Find Patent Forward Citations

Gong, Shunqiang. (2018). Seal ring for wafer level package (U.S. Patent No. 10128201). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10128201

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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