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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10128177 B1

PDFFull Text
Date of Patent:
Nov. 13, 2018

Filed:

May. 06, 2014

Multi-layer package with integrated antenna

Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Telesphor Kamgaing, Chandler, AZ (US);

Adel A. Elsherbini, Chandler, AZ (US);

Torrey W. Frank, Chandler, AZ (US);

Assignee:

INTEL CORPORATION, Santa Clara, CA (US);

Attorney:

Schwabe, Williamson & Wyatt, P.C.

Primary Examiner:

Reema Patel

Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/498 (2006.01); G06F 1/16 (2006.01); H01L 21/288 (2006.01); H01L 23/522 (2006.01); H01L 23/66 (2006.01); H01L 23/14 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49838 (2013.01); G06F 1/1613 (2013.01); H01L 21/288 (2013.01); H01L 21/486 (2013.01); H01L 23/145 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 23/49894 (2013.01); H01L 23/5223 (2013.01); H01L 23/66 (2013.01); H01L 21/4857 (2013.01); H01L 23/49816 (2013.01); H01L 23/562 (2013.01); H01L 2223/6672 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73204 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/1421 (2013.01); H01L 2924/1433 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15321 (2013.01); H01L 2924/3511 (2013.01);
Abstract

Embodiments of the present disclosure describe a multi-layer package with antenna and associated techniques and configurations. In one embodiment, an integrated circuit (IC) package assembly includes a first layer having a first side and a second side disposed opposite to the first side a second layer coupled with the first side of the first layer, one or more antenna elements coupled with the second layer and a third layer coupled with the second side of the first layer, wherein the first layer is a reinforcement layer having a tensile modulus that is greater than a tensile modulus of the second layer and the third layer. Other embodiments may be described and/or claimed.

Find Patent Forward Citations

Kamgaing, Telesphor. (2018). Multi-layer package with integrated antenna (U.S. Patent No. 10128177). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10128177

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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