The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 13, 2018

Filed:

Jan. 30, 2017
Applicant:

Fuji Electric Co., Ltd., Kanagawa, JP;

Inventors:

Akira Morozumi, Okaya, JP;

Hiromichi Gohara, Matsumoto, JP;

Yoshitaka Nishimura, Azumino, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/473 (2006.01); H01L 21/50 (2006.01); H01L 23/053 (2006.01); H01L 23/40 (2006.01); H01L 23/42 (2006.01); H01L 25/11 (2006.01);
U.S. Cl.
CPC ...
H01L 23/473 (2013.01); H01L 21/50 (2013.01); H01L 23/053 (2013.01); H01L 23/4006 (2013.01); H01L 23/42 (2013.01); H01L 25/115 (2013.01); H01L 2023/4031 (2013.01); H01L 2023/4087 (2013.01);
Abstract

A semiconductor module is provided, including: a cooling-target device; a first cooling unit on which the cooling-target device is placed and that has a flow channel through which a refrigerant for cooling the cooling-target device flows; and a second cooling unit to which the first cooling unit is fixed and that has a flow channel coupled with the flow channel of the first cooling unit. Also, a semiconductor module manufacturing method is provided, including: placing a cooling-target device on a first cooling unit that has a flow channel through which a refrigerant for cooling the cooling-target device flows; and fixing the first cooling unit to a second cooling unit that has a flow channel coupled with the flow channel of the first cooling unit.


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