The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 13, 2018
Filed:
Jul. 28, 2016
Applicant:
Sunedison Semiconductor Limited (Uen201334164h), Singapore, SG;
Inventors:
Hui Wang, Wildwood, MO (US);
Vandan Tanna, O'Fallon, MO (US);
Tracy Michelle Ragan, Warrenton, MO (US);
James Raymond Capstick, Florissant, MO (US);
Assignee:
GlobalWafers Co., Ltd., , TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/762 (2006.01); H01L 21/306 (2006.01); C09G 1/02 (2006.01); C09K 3/14 (2006.01); H01L 21/02 (2006.01); G09G 1/02 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76254 (2013.01); C09G 1/02 (2013.01); C09K 3/1436 (2013.01); C09K 3/1463 (2013.01); H01L 21/02024 (2013.01); H01L 21/30625 (2013.01);
Abstract
Polishing slurries for polishing semiconductor substrates are disclosed. The polishing slurry may include first and second sets of colloidal silica particles with the second set having a silica content greater than the first set.