The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 13, 2018

Filed:

Sep. 02, 2013
Applicant:

Semiconductor Technologies & Instruments Pte Ltd, Singapore, SG;

Inventor:

Jing Lin, Singapore, SG;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/68 (2006.01); G01N 21/95 (2006.01); G01B 11/27 (2006.01); H01L 21/683 (2006.01); B25J 11/00 (2006.01); B25J 15/06 (2006.01); H01L 21/677 (2006.01); H01L 21/687 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 21/681 (2013.01); B25J 11/0095 (2013.01); B25J 15/0616 (2013.01); B25J 15/0658 (2013.01); B25J 15/0666 (2013.01); G01B 11/27 (2013.01); G01N 21/9501 (2013.01); H01L 21/67144 (2013.01); H01L 21/67706 (2013.01); H01L 21/6838 (2013.01); H01L 21/68757 (2013.01); G01N 2201/025 (2013.01); Y10T 29/49826 (2015.01);
Abstract

Automatically correcting for rotational misalignment of a wafer improperly mounted on a film frame includes capturing an image of portions of the wafer using an image capture device, prior to initiation of a wafer inspection procedure by an inspection system; digitally determining a rotational misalignment angle and a rotational misalignment direction of the wafer relative to the film frame and/or a set of reference axes of a field of view of the image capture device; and correcting for the rotational misalignment of the wafer by way of a film frame handling apparatus separate from the inspection system, which is configured for rotating the film frame across the rotational misalignment angle in a direction opposite to the rotational misalignment direction. Such film frame rotation can occur prior to placement of the film frame on the wafer table, without decreasing film frame handling throughput or inspection process throughput.


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