The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 13, 2018

Filed:

Oct. 24, 2017
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Jiayin Huang, San Jose, CA (US);

Zhijun Chen, San Jose, CA (US);

Anchuan Wang, San Jose, CA (US);

Nitin Ingle, San Jose, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/3065 (2006.01); H01L 21/3213 (2006.01); H01L 21/768 (2006.01); C23C 16/455 (2006.01); H01J 37/32 (2006.01); C23C 16/40 (2006.01); C23C 16/34 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32422 (2013.01); C23C 16/345 (2013.01); C23C 16/401 (2013.01); C23C 16/45529 (2013.01); C23C 16/45553 (2013.01); H01L 21/0217 (2013.01); H01L 21/02164 (2013.01); H01L 21/32137 (2013.01); H01L 21/76879 (2013.01);
Abstract

Exemplary methods for treating a silicon-containing substrate may include flowing plasma effluents of a hydrogen-containing precursor into a processing region of the semiconductor processing chamber. A silicon-containing substrate may be positioned within the processing region and include a trench formed through stacked layers including alternating layers of silicon nitride and silicon oxide exposing a portion of the silicon-containing substrate. The methods may include contacting the exposed portion of the silicon-containing substrate with the plasma effluents. The methods may include flowing an oxygen-containing precursor into the processing region of the semiconductor processing chamber. The methods may include contacting the exposed portion of the silicon-containing substrate with the oxygen-containing precursor. The methods may also include converting the exposed portion of the silicon-containing substrate to silicon oxide.


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