The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 13, 2018

Filed:

Sep. 06, 2016
Applicant:

Cooler Master Co., Ltd., New Taipei, TW;

Inventors:

Chien-Hung Sun, New Taipei, TW;

Lei-Lei Liu, New Taipei, TW;

Xiaomin Zhang, New Taipei, TW;

Assignee:

COOLER MASTER CO., LTD., New Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F28D 15/04 (2006.01); F28D 15/02 (2006.01); F28F 1/32 (2006.01);
U.S. Cl.
CPC ...
F28D 15/04 (2013.01); F28D 15/0266 (2013.01); F28D 15/046 (2013.01); F28F 1/32 (2013.01);
Abstract

A three-dimensional heat transfer device includes a vapor chamber and at least one heat pipe. The vapor chamber has a first plate and a second plate opposite to each other, and a first capillary structure is disposed on an inner surface of the first plate. A second capillary structure is disposed in the heat pipe, the second capillary structure has a contact portion extending out of the heat pipe and exposed therefrom. The heat pipe is vertically inserted through the second plate. The contact portion extends into the vapor chamber and is connected to the first capillary structure, so that the first and second capillary structures communicate with each other. Therefore, an overall three-dimensional heat transfer effect can be achieved, and a desired optimized heat dissipation effect is obtained when the vapor chamber collaborates with the heat pipe.


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