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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10125417 B1

PDFFull Text
Date of Patent:
Nov. 13, 2018

Filed:

Jul. 27, 2015

Sintered oxide, method for its production, and sputtering target

Applicant:

Tosoh Corporation, Shunan-shi, Yamaguchi, JP;

Inventors:

Kenji Omi, Kanagawa, JP;

Kenichi Itoh, Kanagawa, JP;

Kentarou Utsumi, Tokyo, JP;

Assignee:

TOSOH CORPORATION, Shunan-shi, Yamaguchi, JP;

Attorney:

Sughrue Mion, PLLC

Primary Examiner:

Mark Kopec

Int. Cl.
CPC ...
H01B 1/08 (2006.01); C04B 35/45 (2006.01); C23C 14/08 (2006.01); C04B 35/453 (2006.01); C23C 14/34 (2006.01); C04B 35/462 (2006.01); C04B 35/64 (2006.01); H01B 1/02 (2006.01); H01B 5/14 (2006.01); C04B 35/44 (2006.01);
U.S. Cl.
CPC ...
C23C 14/086 (2013.01); C04B 35/44 (2013.01); C04B 35/453 (2013.01); C04B 35/462 (2013.01); C04B 35/64 (2013.01); C23C 14/08 (2013.01); C23C 14/081 (2013.01); C23C 14/083 (2013.01); C23C 14/34 (2013.01); C23C 14/3414 (2013.01); H01B 1/023 (2013.01); H01B 1/08 (2013.01); H01B 5/14 (2013.01); C04B 2235/3217 (2013.01); C04B 2235/3222 (2013.01); C04B 2235/3232 (2013.01); C04B 2235/3234 (2013.01); C04B 2235/3284 (2013.01); C04B 2235/5409 (2013.01); C04B 2235/5436 (2013.01); C04B 2235/5445 (2013.01); C04B 2235/5463 (2013.01); C04B 2235/602 (2013.01); C04B 2235/656 (2013.01); C04B 2235/6562 (2013.01); C04B 2235/6565 (2013.01); C04B 2235/6567 (2013.01); C04B 2235/6585 (2013.01); C04B 2235/6586 (2013.01); C04B 2235/77 (2013.01); C04B 2235/80 (2013.01);
Abstract

The purpose of the present invention is to provide a sintered oxide to be used for a sputtering target, whereby little abnormal discharge occurs even during high-power film-deposition and no cracking occurs in the target. A sintered oxide having zinc, aluminum, titanium and oxygen, as constituent elements, characterized in that when the contents of zinc, aluminum and titanium are represented by Zn, Al, and Ti, respectively, the atomic ratios of the elements constituting the sintered oxide areAl/(Zn+Al+Ti)=0.035 to 0.050 andTi/(Zn+Al+Ti)=0.05 to 0.20,and the average grain size of crystal grains having a ZnTiOcrystal phase as the matrix phase in the sintered oxide, is at most 5 μm.

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